advanced-packaging

Turn existing CAE files into structured text an agent can use — COMSOL, Abaqus, Fluent, HFSS, Icepak, FloTHERM — plus solver detection, script linting, and live solver sessions. Strong coverage for electronics thermal and advanced packaging.

A curated list of semiconductor industry resources, with a deliberate bias toward sub-10nm logic, lithography, process technology, and advanced packaging.

True 3D Global Placement GUI Viewer -- An interactive 3D visualization demo for 3D IC placement. Built for the era of Huawei's Tao (τ) Law and Logic Folding, where 3D placement becomes the key enabler for next-generation chip density beyond Moore's Law.

🔲 Chip substrate — 28-verb semiconductor stack (architecture / design / EDA / process / packaging / NPU / PIM / 3D / photonic / RTL-gen / yield / consciousness-chip).

Foundry/IP Decision Intelligence — 10 RSS → RAW (immutable) → NORMALIZED → DEDUPE → EVENTS (EID_v0.1) → GATE → RIT_v0.2 → Decision Signals → Weekly Brief → Email. No LLM, provenance-first.

免费中文先进封装课程 / Free Chinese-language course: 40 lessons on Chiplets, HBM, 2.5D/3D, engineering, and industry research.

End-to-end fabrication and characterization of a glass-core package substrate for heterogeneous integration.

Amkor Technology — independent third-party profile of a public API surface, by API Evangelist. Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries.

The AI Constraint Relay: moving bottlenecks across power, labour, equipment and cost incidence. DOI 10.5281/zenodo.20586863

Syenta — independent third-party profile of a public API surface, by API Evangelist. Syenta is an Australian deep-tech semiconductor company (founded 2022, spun out of the Australian National University, with teams across Australia, Europe and the United States) building manufacturing equipment for advanced chip packaging.